
FPC以聚酰亚胺或聚酯薄膜等柔性基材制成,具有配线密度高、重量轻、厚度薄、可弯曲、灵活度高等优点,能承受数百万次的动态弯曲而不损坏导线,依照空间布局要求任意移动和伸缩,实现三维组装,达到元器件装配和导线连接一体化的效果,具有其他类型电路板无法比拟的优势。并广泛应用于移动电话、电脑与液晶荧幕,CD随身听和磁碟机等产品中。
Layer Count | 1-14 Layers |
Material | PI, PET |
Stiffening Material | FR4/PI/PET/SUS/PSA |
Finished Board Thickness | 0.06-0.6mm+/-0.03mm |
Finished Copper Thickness | 12um-70um |
Max. FPC Size | 250X4000mm |
Min. Drilling Size | 0.15mm, 0.1mm(laser drilling) |
Min. Line Width/Space | 2/2mil |
Surface Finish | ENIG, Immersiong Ag, Plated Gold, Plated Sn, OSP |
Standard | IPC Class 2, IPC Class 3, Millitary |