10L ENIG Power Cu 6oz
Advantages of multilayer circuit board:
1. High density, small size and light weight;
2. Due to the high assembly density, the connection between subassemblys (including components) is reduced, so improved the reliability;
3. The number of wiring layers can be increased, thus increasing the flexibility of design;
4. Constitute a circuit with a certain impedance control;
5. Form a high-speed transmission circuit;
4. The shielding layer of circuit and magnetic circuit can be set, and the heat dissipation layer of metal core can be set to meet the needs of special functions such as shielding and heat dissipation;
5. Simple installation and high reliability.
1. High density, small size and light weight;
2. Due to the high assembly density, the connection between subassemblys (including components) is reduced, so improved the reliability;
3. The number of wiring layers can be increased, thus increasing the flexibility of design;
4. Constitute a circuit with a certain impedance control;
5. Form a high-speed transmission circuit;
4. The shielding layer of circuit and magnetic circuit can be set, and the heat dissipation layer of metal core can be set to meet the needs of special functions such as shielding and heat dissipation;
5. Simple installation and high reliability.
Layer Count | 10 Layers |
Material | FR4 Tg150 |
Finished Board Thickness | 2.0 mm |
Finished Copper Thickness | 6 OZ |
Min. Drilling | 0.35mm |
Min. Wall Cu Thickness | 25um |
Min. Line Width/Space | 4/4mil |
Surface Treatment | ENIG |
Speciality | Finished Cu 6OZ |
Application | Power |